Integrated circuit ground system

专利名称：Integrated circuit ground system发明人：Ahmadreza Rofougaran申请号：US10836875申请日：20040430公开号：US07170166B2公开日：20070130

专利附图：

摘要：An integrated circuit ground system includes an integrated circuit (IC) groundconnection, first and second IC package pins, first and second printed circuit board (PCB)pads, a PCB ground connection, and a resonant circuit. The IC ground connection isfabricated on a substrate of an integrated circuit. The first IC package pin is operably

coupled to the IC ground connection via a first bond wire. The second IC package pin isoperably coupled to the IC ground connection via a second bond wire. The second PCBpad is operably coupled to the second IC package pin to provide a low impedance DCground connection for the integrated circuit to the printed circuit board. The resonantcircuit is operably coupling the first IC package pin to the first PCB pad, wherein theresonant circuit is tuned to resonant with the first bond wire at high frequency range toprovide a low impedance AC ground connection for the integrated circuit to the printedcircuit board within the high frequency range.

申请人：Ahmadreza Rofougaran

地址：Marina Del Ray CA US

国籍：US

代理机构：Garlick Harrison & Markison

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