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93lc46

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Not recommended for new designs –Please use 93LC46C, 93LC56C or 93LC66C.

93LC46/56/66

1K/2K/4K 2.5V Microwire Serial EEPROM

Features:

•Single supply with programming operation down to 2.5V

•Low-power CMOS technology

•100µA typical active read current at 2.5V•3µA typical standby current at 2.5V

•ORG pin selectable memory configuration•128 x 8- or x 16-bit organization (93LC46)•256 x 8- or 128 x 16-bit organization (93LC56)•512 x 8 or 256 x 16 bit organization (93LC66)•Self-timed erase and write cycles(including auto-erase)

•Automatic ERAL before WRAL

•Power on/off data protection circuitry•Industry standard 3-wire serial I/O

•Device status signal during erase/write cycles•Sequential read function

•1,000,000 E/W cycles ensured •Data retention > 200 years•8-pin PDIP/SOIC

(SOIC in JEDEC standards)•Temperature ranges supported:-Industrial (I):

-40°C to+85°C

Package Types

PDIP/SOIC

CSCLKDIDO

ROTATED SOIC

NUVCCCSCLK

1234

8765

ORGVSSDODI

93LC46X93LC56X93LC66X1234

8765

VCCNUORGVSS

93LC4693LC5693LC66Block Diagram

VCC

VSS

AddressDecoder

MemoryArray

AddressCounter

OutputBuffer

Description:

The Microchip Technology Inc. 93LC46/56/66 are 1K,2K and 4K low voltage serial Electrically ErasablePROMs (EEPROM). The device memory is configuredas x8 or x16 bits depending on the external logic oflevels of the ORG pin. Advanced CMOS technologymakes these devices ideal for low power nonvolatilememory applications. The 93LC Series is available instandard 8-pin PDIP and surface mount SOICpackages. The rotated pin-out 93LC46X/56X/66X areoffered in the “SN” package only.

Data Register

DIORGCS

ModeDecodeLogic

CLK

ClockRegister

 2004 Microchip Technology Inc.DS21712B-page 1

93LC46/56/66

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings(†)

VCC.............................................................................................................................................................................6.5VAll inputs and outputs w.r.t. VSS........................................................................................................-0.6V to VCC + 1.0VStorage temperature...............................................................................................................................-65°C to +150°CAmbient temperature with power applied................................................................................................-40°C to +125°CESD protection on all pins......................................................................................................................................................≥4kV† NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. Thisis a stress rating only and functional operation of the device at those or any other conditions above those indicated inthe operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periodsmay affect device reliability.

DC CHARACTERISTICS

DC CHARACTERISTICSParam.No.D1D2D3D4D5D6D7D8D9

SymVIH1VIH2VIL1VIL2VOL1VOL2VOH1VOH2ILIILOCIN, COUT

Input leakage currentOutput leakage currentPin capacitance(all inputs/outputs)High-level output voltageLow-level output voltageLow-level input voltage

CharacteristicHigh-level input voltage

VCC = +2.5V to +5.5V

Industrial (I):TA = -40°C to +85°CMin2.00.7 VCC-0.3-0.3——2.4VCC -0.2———————

Standby current

———

Typ——————————————100——3

MaxVCC +1VCC +10.80.2 VCC0.40.3——±10±10731500—10030—

UnitsVVVVVVVVµAµApFmAmAµAµAµAµAµA

Conditions

VCC ≥ 2.7VVCC ≥ 2.7VVCC ≥ 2.7VVCC ≥ 2.7V

IOL = 2.1mA, VCC = 4.5V

IOL = 100µA, VCC = 2.5VIOL = 400µA, VCC = 4.5VIOL = 100µA, VCC = 2.5VVIN = 0.1V to VCCVOUT = 0.1V to VCC

VIN/VOUT = 0V (Note1 & 2)TA = 25°C, FCLK = 1MHzFCLK = 2MHz, VCC = 5.5V (Note2)

FCLK = 2MHz, VCC = 5.5VFCLK = 1MHz, VCC = 3.0VFCLK = 1MHz, VCC = 2.5VCLK = CS = 0V; VCC = 5.5VCLK = CS = 0V; VCC = 3.0VCLK = CS = 0V; VCC = 2.5VORG, DI = VSS or VCC

ICC writeOperating currentICC read

D10ICCS

Note1:

2:This parameter is tested at TA = 25°C and FCLK = 1MHz.This parameter is periodically sampled and not 100% tested.

DS21712B-page 2 2004 Microchip Technology Inc.

93LC46/56/66

AC CHARACTERISTICS

AC CHARACTERISTICSParam.No.1234567101112131415Note1:

2:3:

SymFCLKTCKHTCKLTCSSTCSHTCSLTDISTDIHTPDTCZTSVTWCTECTWL—

Endurance

CharacteristicClock frequencyClock high timeClock low timeChip select setup timeChip select hold timeChip select low timeData input setup timeData input hold timeData output delay timeData output disable timeStatus valid timeProgram cycle time

VCC = +2.5V to +5.5V

Industrial (I):TA = -40°C to +85°C

Min——250250500250100100——————1M

Typ————————————4816—

Max21———————4001005001015301M

UnitsMHzMHznsnsnsnsnsnsnsnsnsnsmsmsms

Relative to CLKRelative to CLKCL = 100pFCL = 100pf (Note2)CL = 100pFErase/Write mode

ERAL mode (VCC=5V ±10%)WRAL mode (VCC=5V ±10%)Relative to CLKRelative to CLK

Conditions

VCC ≥ 4.5VVCC < 4.5V

cycles25°C, VCC = 5.0V, Block

mode (Note3)

This parameter is tested at TA = 25°C and FCLK = 1MHz.This parameter is periodically sampled and not 100% tested.

This parameter is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site at: www.microchip.com.

FIGURE 1-1:

VIHVIL

CLK

VIHVIL

SYNCHRONOUS DATA TIMING

423

VIHVIL

DOVOH(Read)

VOLDOVOH(Write)

VOL

Status Valid

 2004 Microchip Technology Inc.DS21712B-page 3

93LC46/56/66

TABLE 1-1:

InstructionREADEWENERASEERALWRITEWRALEWDS

INSTRUCTION SET FOR 93LC46: ORG = 1 (X 16 ORGANIZATION)

SB1111111

Opcode10001100010000

Address

A5 A4 A3 A2 A1 A01 1 XXXX

A5 A4 A3 A2 A1 A01 0 XXXX

A5 A4 A3 A2 A1 A00 1 XXXX0 0 XXXX

Data In ————D15 - D0D15 - D0

—

Data Out D15 - D0 High-Z (RDY/BSY) (RDY/BSY) (RDY/BSY) (RDY/BSY) High-Z

Req. CLK Cycles

2599925259

TABLE 1-2:

InstructionREADEWENERASEERALWRITEWRALEWDS

INSTRUCTION SET FOR 93LC46: ORG = 0 (X 8 ORGANIZATION)

SB1111111

Opcode10001100010000

Address

A6 A5 A4 A3 A2 A1 A01 1 X X X X X A6 A5 A4 A3 A2 A1 A01 0 X X X X X

A6 A5 A4 A3 A2 A1 A00 1 X X X X X0 0 X X X X X

Data In ——— —D7 - D0D7 - D0 —

Data Out D7 - D0High-Z (RDY/BSY)(RDY/BSY) (RDY/BSY)(RDY/BSY)High-Z

Req. CLK Cycles

18101010181810

TABLE 1-3:

InstructionREADEWENERASEERALWRITEWRALEWDS

INSTRUCTION SET FOR 93LC56: ORG = 1 (X 16 ORGANIZATION)

SB1111111

Opcode10001100010000

Address

X A6 A5 A4 A3 A2 A1 A01 1 X X X X X X X A6 A5 A4 A3 A2 A1 A01 0 X X X X X X

X A6 A5 A4 A3 A2 A1 A00 1 X X X X X X0 0 X X X X X X

Data In ——— —D15 - D0D15 - D0 —

Data Out D15 - D0High-Z (RDY/BSY)(RDY/BSY) (RDY/BSY)(RDY/BSY)High-Z

Req. CLK Cycles

27111111272711

TABLE 1-4:

InstructionREADEWENERASEERALWRITEWRALEWDS

INSTRUCTION SET FOR 93LC56: ORG = 0 (X 8 ORGANIZATION)

SB1111111

Opcode10001100010000

Address

X A7 A6 A5 A4 A3 A2 A1 A01 1 X X X X X X X

X A7 A6 A5 A4 A3 A2 A1 A01 0 X X X X X X X

X A7 A6 A5 A4 A3 A2 A1 A00 1 X X X X X X X0 0 X X X X X X X

Data In —— — — D7 - D0 D7 - D0 —

Data OutD7 - D0High-Z(RDY/BSY)(RDY/BSY)(RDY/BSY)(RDY/BSY)High-Z

Req. CLK Cycles

20121212202012

DS21712B-page 4 2004 Microchip Technology Inc.

93LC46/56/66

TABLE 1-5:

InstructionREADEWENERASEERALWRITEWRALEWDS

INSTRUCTION SET FOR 93LC66: ORG = 1 (X 16 ORGANIZATION)

SB1111111

Opcode10001100010000

Address

A7 A6 A5 A4 A3 A2 A1 A01 1 X X X X X X

A7 A6 A5 A4 A3 A2 A1 A01 0 X X X X X X

A7 A6 A5 A4 A3 A2 A1 A00 1 X X X X X X0 0 X X X X X X

Data In ——— —D15 - D0D15 - D0 —

Data Out D15 - D0High-Z (RDY/BSY)(RDY/BSY) (RDY/BSY)(RDY/BSY)High-Z

Req. CLK Cycles

27111111272711

TABLE 1-6:

InstructionREADEWENERASEERALWRITEWRALEWDS

INSTRUCTION SET FOR 93LC66: ORG = 0 (X 8 ORGANIZATION)

SB1111111

Opcode10001100010000

Address

A8 A7 A6 A5 A4 A3 A2 A1 A01 1 X X X X X X X

A8 A7 A6 A5 A4 A3 A2 A1 A01 0 X X X X X X X

A8 A7 A6 A5 A4 A3 A2 A1 A00 1 X X X X X X X0 0 X X X X X X X

Data In —— — — D7 - D0 D7 - D0 —

Data OutD7 - D0High-Z(RDY/BSY)(RDY/BSY)(RDY/BSY)(RDY/BSY)High-Z

Req. CLK Cycles

20121212202012

 2004 Microchip Technology Inc.DS21712B-page 5

93LC46/56/66

2.0

FUNCTIONAL DESCRIPTION

When the ORG pin is connected to VCC, the (x16)organization is selected. When it is connected toground, the (x8) organization is selected. Instruc-tions, addresses and write data are clocked into theDI pin on the rising edge of the clock (CLK). The DOpin is normally held in a high-Z state except whenreading data from the device, or when checking theReady/Busy status during a programming operation.The Ready/Busy status can be verified during anerase/write operation by polling the DO pin; DO lowindicates that programming is still in progress, whileDO high indicates the device is ready. The DO willenter the high-Z state on the falling edge of the CS.

After power-up, the device is automatically in theEWDS mode. Therefore, an EWEN instruction must beperformed before any ERASE or WRITE instruction canbe executed.

2.4Read

The READ instruction outputs the serial data of theaddressed memory location on the DO pin. A dummyzero bit precedes the 16-bit (x16 organization) or 8-bit(x8 organization) output string. The output data bits willtoggle on the rising edge of the CLK and are stableafter the specified time delay (TPD). Sequential read ispossible when CS is held high. The memory data willautomatically cycle to the next register and outputsequentially.

2.1Start Condition

The Start bit is detected by the device if CS and DI areboth high with respect to the positive edge of CLK forthe first time.

Before a Start condition is detected, CS, CLK and DImay change in any combination (except to that of aStart condition), without resulting in any device opera-tion (Read, Write, Erase, EWEN, EWDS, ERAL andWRAL). As soon as CS is high, the device is no longerin the Standby mode.

An instruction following a Start condition will only beexecuted if the required amount of opcode, addressand data bits for any particular instruction is clocked in.After execution of an instruction (i.e., clock in or out ofthe last required address or data bit) CLK and DIbecome “don't care” bits until a new Start condition isdetected.

2.5

Erase/Write Enable and Disable (EWEN, EWDS)

The 93LC46/56/66 power up in the Erase/Write Disable(EWDS) state. All programming modes must bepreceded by an Erase/Write Enable (EWEN) instruction.Once the EWEN instruction is executed, programmingremains enabled until an EWDS instruction is executedor VCC is removed from the device. To protect againstaccidental data disturb, the EWDS instruction can beused to disable all erase/write functions and shouldfollow all programming operations. Execution of a READinstruction is independent of both the EWEN and EWDSinstructions.

2.6Erase

2.2Data In/Data Out (DI/DO)

It is possible to connect the Data In and Data Out pinstogether. However, with this configuration it is possiblefor a “bus conflict” to occur during the “dummy zero”that precedes the read operation, if A0 is a logic highlevel. Under such a condition the voltage level seen atData Out is undefined and will depend upon the relativeimpedances of Data Out and the signal source drivingA0. The higher the current sourcing capability of A0,the higher the voltage at the Data Out pin.

The ERASE instruction forces all data bits of the speci-fied address to the logical “1” state. CS is brought lowfollowing the loading of the last address bit. This fallingedge of the CS pin initiates the self-timed programmingcycle.

The DO pin indicates the Ready/Busy status of thedevice if CS is brought high after a minimum of 250nslow (TCSL). DO at logical “0” indicates that program-ming is still in progress. DO at logical “1” indicates thatthe register at the specified address has been erasedand the device is ready for another instruction.The erase cycle takes 4ms per word typical.

2.3Data Protection

During power-up, all programming modes of operationare inhibited until VCC has reached a level greater than1.4V. During power-down, the source data protectioncircuitry acts to inhibit all programming modes whenVCC has fallen below 1.4V at nominal conditions.The EWEN and EWDS commands give additionalprotection against accidentally programming duringnormal operation.

DS21712B-page 6 2004 Microchip Technology Inc.

93LC46/56/66

2.7

Write

The WRITE instruction is followed by 16 bits (or by 8bits) of data which are written into the specifiedaddress. After the last data bit is put on the DI pin,CS must be brought low before the next rising edgeof the CLK clock. This falling edge of CS initiates theself-timed auto-erase and programming cycle.The DO pin indicates the Ready/Busy status of thedevice if CS is brought high after a minimum of 250nslow (TCSL) and before the entire write cycle is complete.DO at logical “0” indicates that programming is still inprogress. DO at logical “1” indicates that the register atthe specified address has been written with the dataspecified and the device is ready for anotherinstruction.

The write cycle takes 4ms per word typical.

The DO pin indicates the Ready/Busy status of thedevice if CS is brought high after a minimum of 250nslow (TCSL) and before the entire write cycle is complete.The ERAL cycle takes (8ms typical).

2.9Write All (WRAL)

The WRAL instruction will write the entire memory arraywith the data specified in the command. The WRALcycle is completely self-timed and commences at thefalling edge of the CS. Clocking of the CLK pin is notnecessary after the device has entered the self clock-ing mode. The WRAL command does include an auto-matic ERAL cycle for the device. Therefore, the WRALinstruction does not require an ERAL instruction but thechip must be in the EWEN status. The WRAL instructionis ensured at 5V ±10%.

The DO pin indicates the Ready/Busy status of thedevice if CS is brought high after a minimum of 250nslow (Tcsl).

The WRAL cycle takes 16ms typical.

2.8Erase All (ERAL)

The ERAL instruction will erase the entire memory arrayto the logical “1” state. The ERAL cycle is identical tothe ERASE cycle except for the different opcode. TheERAL cycle is completely self-timed and commencesat the falling edge of the CS. Clocking of the CLK pin isnot necessary after the device has entered the selfclocking mode. The ERAL instruction is ensured at 5V±10%.

FIGURE 2-1:

READ TIMING

CLKDI

•••A0

High-Z

0Dx•••D0Dx•••D0Dx•••D0

 2004 Microchip Technology Inc.DS21712B-page 7

93LC46/56/66

FIGURE 2-2:

EWEN TIMING

10011X•••X

FIGURE 2-3:EWDS TIMING

CLK

10000X•••X

FIGURE 2-4:WRITE TIMING

CLK

101An•••A0Dx•••D0

High-Z

Busy12

Ready

DS21712B-page 8 2004 Microchip Technology Inc.

93LC46/56/66

FIGURE 2-5:

WRAL TIMING

CLK

DI10001X•••XDx•••D0

High-ZBusy

Ready

High-Z

Ensured by Characterization at VCC = 4.5V to +5.5V.

FIGURE 2-6: ERASE TIMING

Check Status

CLK

111AnAn-1An-2•••A0

Busy

Ready

High-Z

FIGURE 2-7: ERAL TIMING

Check Status

CLK

DI10010X•••X

BusyDO

High-Z

Ready

High-Z

Ensured by Characterization at Vcc = 4.5V to +5.5V.

 2004 Microchip Technology Inc.DS21712B-page 9

93LC46/56/66

3.0

PIN DESCRIPTION

The descriptions of the pins are listed in Table3-1.

TABLE 3-1:

NameCSCLKDIDOVSSORGNUVcc

PIN FUNCTION TABLE

PDIP12345678

SOIC12345678

ROTATEDTSSOP

34567812Note:

Chip SelectSerial Data ClockSerial Data InputSerial Data OutputGround

Memory ConfigurationNot Utilized

+1.8V to 5.5V Power Supply

CS must go low between consecutiveinstructions.

Description

3.1Chip Select (CS)

A high level selects the device. A low level deselectsthe device and forces it into Standby mode. However, aprogramming cycle which is already initiated and/or inprogress will be completed, regardless of the CS inputsignal. If CS is brought low during a program cycle, thedevice will go into Standby mode as soon as theprogramming cycle is completed.

CS must be low for 250ns minimum (TCSL) betweenconsecutive instructions. If CS is low, the internalcontrol logic is held in a Reset status.

3.3Data In (DI)

Data In is used to clock in a Start bit, opcode, addressand data synchronously with the CLK input.

3.4Data Out (DO)

Data Out is used in the Read mode to output data syn-chronously with the CLK input (TPD after the positiveedge of CLK).

This pin also provides Ready/Busy status informationduring erase and write cycles. Ready/Busy status infor-mation is available on the DO pin if CS is brought highafter being low for minimum chip select low time (TCSL)and an erase or write operation has been initiated.The Status signal is not available on DO, if CS is heldlow or high during the entire write or erase cycle. In allother cases DO is in the High-Z mode. If status ischecked after the write/erase cycle, a pull-up resistoron DO is required to read the Ready signal.

3.2Serial Clock (CLK)

The serial clock is used to synchronize the communica-tion between a master device and the 93LC46/56/66.Opcode, address and data bits are clocked in on thepositive edge of CLK. Data bits are also clocked out onthe positive edge of CLK.

CLK can be stopped anywhere in the transmissionsequence (at high or low level) and can be continuedanytime with respect to clock high time (TCKH) andclock low time (TCKL). This gives the controlling masterfreedom in preparing opcode, address and data.CLK is a “don't care” if CS is low (device deselected). IfCS is high, but Start condition has not been detected,any number of clock cycles can be received by thedevice without changing its status (i.e., waiting for Startcondition).

CLK cycles are not required during the self-timed write(i.e., auto erase/write) cycle.

After detection of a Start condition the specified numberof clock cycles (respectively low-to-high transitions ofCLK) must be provided. These clock cycles are requiredto clock in all required opcode, address and data bitsbefore an instruction is executed (see instruction settruth table). CLK and DI then become “don't care” inputswaiting for a new Start condition to be detected.

3.5Organization (ORG)

When ORG is connected to VCC, the (x16) memoryorganization is selected. When ORG is tied to VSS, the(x8) memory organization is selected. ORG can only befloated for clock speeds of 1MHz or less for the (x16)memory organization. For clock speeds greater than1MHz, ORG must be tied to VCC or VSS.

DS21712B-page 10 2004 Microchip Technology Inc.

93LC46/56/66

4.0

4.1

PACKAGING INFORMATION

Package Marking Information

8-Lead PDIP (300 mil)

XXXXXXXXXXXXXNNNYYWWExample:

93LC46I/PNNNYYWW8-Lead SOIC (150 mil)

XXXXXXXXXXXXYYWWNNNExample:

93LC46I/SNYYWWNNN8-Lead Rotated SOIC (150 mil)

XXXXXXXXXXXXYYWWNNNExample:

93LC46XI/SNYYWWNNNLegend: XX...X

YYWWNNNNote:

Customer specific information*

Year code (last 2 digits of calendar year)Week code (week of January 1 is week ‘01’)Alphanumeric traceability code

In the event the full Microchip part number cannot be marked on one line, it willbe carried over to the next line thus limiting the number of available charactersfor customer specific information.

*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

 2004 Microchip Technology Inc.DS21712B-page 11

93LC46/56/66

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

Number of PinsPitch

Top to Seating Plane

Molded Package ThicknessBase to Seating Plane

Shoulder to Shoulder WidthMolded Package WidthOverall Length

Tip to Seating PlaneLead ThicknessUpper Lead WidthLower Lead WidthOverall Row SpacingMold Draft Angle TopMold Draft Angle Bottom* Controlling Parameter§ Significant Characteristic

Units

Dimension Limits

npAA2A1EE1DLcB1BeBαβ

MIN

INCHES*NOM

8.100.155.130.313.250.373.130.012.058.018.3701010

MAX

.140.115.015.300.240.360.125.008.045.014.31055

.170.145.325.260.385.135.015.070.022.4301515

MILLIMETERS

MINNOM

82.

3.563.942.923.300.387.627.946.106.359.149.463.183.300.200.291.141.460.360.467.879.40510510

MAX

4.32

3.688.266.609.783.430.381.780.5610.921515

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.2mm) per side.JEDEC Equivalent: MS-001Drawing No. C04-018

DS21712B-page 12 2004 Microchip Technology Inc.

93LC46/56/66

8-Lead Plastic Small Outline (SN) –Narrow, 150 mil (SOIC)

EE1

45×

Number of PinsPitch

Overall Height

Molded Package ThicknessStandoff§Overall Width

Molded Package WidthOverall LengthChamfer DistanceFoot LengthFoot Angle

Lead ThicknessLead Width

Mold Draft Angle TopMold Draft Angle Bottom* Controlling Parameter§ Significant Characteristic

Units

Dimension Limits

npAA2A1EE1DhLfcBαβ

MIN

.053.052.004.228.146.1.010.0190.008.01300

INCHES*NOM

8.050.061.056.007.237.1.193.015.02.009.0171212

MAXMIN

.069.061.010.244.157.197.020.0308.010.0201515

MILLIMETERS

NOM

81.27

1.351.551.321.420.100.185.796.023.713.914.804.900.250.380.480.62040.200.230.330.42012012

MAX

1.75

1.550.256.203.995.000.510.7680.250.511515

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.2mm) per side.JEDEC Equivalent: MS-012Drawing No. C04-057

 2004 Microchip Technology Inc.DS21712B-page 13

93LC46/56/66

APPENDIX A:

Revision B

Added note to page 1 header (Not recommended fornew designs).

Updated document format.

REVISION HISTORY

DS21712B-page 14 2004 Microchip Technology Inc.

93LC46/56/66

ON-LINE SUPPORT

Microchip provides on-line support on the MicrochipWorld Wide Web site.

The web site is used by Microchip as a means to makefiles and information easily available to customers. Toview the site, the user must have access to the Internetand a web browser, such as Netscape® or Microsoft®Internet Explorer. Files are also available for FTPdownload from our FTP site.

SYSTEMS INFORMATION AND UPGRADE HOT LINE

The Systems Information and Upgrade Line providessystem users a listing of the latest versions of all ofMicrochip's development systems software products.Plus, this line provides information on how customerscan receive the most current upgrade kits. The Hot LineNumbers are:

1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world.

042003

Connecting to the Microchip Internet Web Site

The Microchip web site is available at the followingURL:

www.microchip.com

The file transfer site is available by using an FTPservice to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety ofservices. Users may download files for the latestDevelopment Tools, Data Sheets, Application Notes,User's Guides, Articles and Sample Programs. A vari-ety of Microchip specific business information is alsoavailable, including listings of Microchip sales offices,distributors and factory representatives. Other dataavailable for consideration is:

•Latest Microchip Press Releases

•Technical Support Section with Frequently Asked Questions •Design Tips•Device Errata•Job Postings

•Microchip Consultant Program Member Listing•Links to other useful web sites related to Microchip Products

•Conferences for products, Development Systems, technical information and more•Listing of seminars and events

 2004 Microchip Technology Inc.DS21712B-page 15

93LC46/56/66

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentationcan better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.Please list the following information, and use this outline to provide us with your comments about this document.

To:RE:

Technical Publications ManagerReader Response

Total Pages Sent ________

From:Name

CompanyAddress

City / State / ZIP / Country

Telephone: (_______) _________ - _________

Application (optional):

Would you like a reply? Y N

93LC46/56/66DS21712BDevice: Literature Number: Questions:

1.What are the best features of this document?

FAX: (______) _________ - _________

2.How does this document meet your hardware and software development needs?

3.Do you find the organization of this document easy to follow? If not, why?

4.What additions to the document do you think would enhance the structure and subject?

5.What deletions from the document could be made without affecting the overall usefulness?

6.Is there any incorrect or misleading information (what and where)?

7.How would you improve this document?

DS21712B-page 16 2004 Microchip Technology Inc.

93LC46/56/66

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.Device

XTemperatureRange

/XXPackage

XXXPattern

Examples:a)b)

93LC46:1K 2.5V Microwire Serial EEPROM93LC46X:1K 2.5V Microwire Serial EEPROM in

alternate pinouts (SN package only)

93LC46T:1K 2.5V Microwire Serial EEPROM

(Tape and Reel)

93LC46XT: 1K 2.5V Microwire Serial EEPROM

(Tape and Reel)

93LC56: 2K 2.5V Microwire Serial EEPROM93LC56X: 2K 2.5V Microwire Serial EEPROM in alternate pinouts (SN package only)93LC56T:2K 2.5V Microwire Serial EEPROM

(Tape and Reel)

93LC56XT:2K 2.5V Microwire Serial EEPROM

(Tape and Reel)

93LC66: 4K 2.5V Microwire Serial EEPROM93LC66X: 4K 2.5V Microwire Serial EEPROM in

alternate pinouts (SN package only)

93LC66T:4K 2.5V Microwire Serial EEPROM

(Tape and Reel)

93LC66XT: 4K 2.5V Microwire Serial EEPROM

(Tape and Reel)I

=-40°C to+85°C

93LC46-I/P: 1K, 128x8 or x16 Serial EEPROM, PDIP package

93LC46-I/SN: 1K, 128x8 or x16 SerialEEPROM, SOIC package

93LC46T-I/SN: 1K, 128x8 or x16Serial EEPROM, SOIC package, tapeand reel

93LC46X-I/SN: 1K, 128x8 or x16Serial EEPROM, Rotated SOIC package93LC56-I/P: 2K, 256x8 or 128x16 Serial EEPROM, PDIP package

93LC56-I/SN: 2K, 256x8 or 128x16Serial EEPROM, SOIC package

93LC56T-I/SN: 2K, 256x8 or 128x16Serial EEPROM, SOIC package, tapeand reel

93LC56X-I/SN: 2K, 256x8 or 128x16Serial EEPROM, Rotated SOIC package93LC66-I/P: 4K, 512x8 or 256x16 Serial EEPROM, PDIP package

93LC66-I/SN: 4K, 512x8 or 256x16Serial EEPROM, SOIC package

93LC66T-I/SN: 4K, 512x8 or 256x16Serial EEPROM, SOIC package, tapeand reel

93LC66X-I/SN: 4K, 512x8 or 256x16Serial EEPROM, Rotated SOIC package

Device

d)e)f)g)

h)i)j)k)

Temperature RangePackage

PSN==Plastic DIP (300 mil body), 8-leadPlastic SOIC (150 mil body), 8-lead

Sales and SupportData Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and

recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:1.2.3.

Your local Microchip sales office

The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.New Customer Notification System

 2004 Microchip Technology Inc.DS21712B-page 17

93LC46/56/66

NOTES:

DS21712B-page 18 2004 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:•••

Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

••

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding deviceapplications and the like is intended through suggestion onlyand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.No representation or warranty is given and no liability isassumed by Microchip Technology Incorporated with respectto the accuracy or use of such information, or infringement ofpatents or other intellectual property rights arising from suchuse or otherwise. Use of Microchip’s products as criticalcomponents in life support systems is not authorized exceptwith express written approval by Microchip. No licenses areconveyed, implicitly or otherwise, under any intellectualproperty rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PROMATE, PowerSmart, rfPIC, and SmartShunt are

registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial

Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,

PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and

procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

 2004 Microchip Technology Inc.DS21712B-page 19

WORLDWIDE SALES AND SERVICE

AMERICAS

Corporate Office

2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7200 Fax: 480-792-7277

Technical Support: 480-792-7627Web Address: www.microchip.com

China - Beijing

Unit 706B

Wan Tai Bei Hai Bldg.

No. 6 Chaoyangmen Bei Str. Beijing, 100027, ChinaTel: 86-10-85282100 Fax: 86-10-85282104

Singapore

200 Middle Road#07-02 Prime CentreSingapore, 1880

Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan

Kaohsiung Branch30F - 1 No. 8

Min Chuan 2nd RoadKaohsiung 806, TaiwanTel: 886-7-536-4816Fax: 886-7-536-4817

China - Chengdu

Rm. 2401-2402, 24th Floor, Ming Xing Financial TowerNo. 88 TIDU Street

Chengdu 610016, ChinaTel: 86-28-86766200 Fax: 86-28-86766599

Atlanta

3780 Mansell Road, Suite 130Alpharetta, GA 30022Tel: 770-0-0034 Fax: 770-0-0307

Taiwan

Taiwan Branch11F-3, No. 207

Tung Hua North RoadTaipei, 105, Taiwan

Tel: 886-2-2717-7175 Fax: 886-2-25-0139

Boston

2 Lan Drive, Suite 120Westford, MA 01886Tel: 978-692-3848 Fax: 978-692-3821

China - Fuzhou

Unit 28F, World Trade PlazaNo. 71 Wusi Road

Fuzhou 350001, ChinaTel: 86-591-7503506 Fax: 86-591-7503521

Taiwan

Taiwan Branch

13F-3, No. 295, Sec. 2, Kung Fu RoadHsinchu City 300, TaiwanTel: 886-3-572-9526Fax: 886-3-572-59

Chicago

333 Pierce Road, Suite 180Itasca, IL 60143Tel: 630-285-0071 Fax: 630-285-0075

China - SAR

Unit 901-6, Tower 2, Metroplaza223 Hing Fong Road

Kwai Fong, N.T., Tel: 852-2401-1200 Fax: 852-2401-3431

Dallas

16200 Addison Road, Suite 255Addison Plaza

Addison, TX 75001Tel: 972-818-7423 Fax: 972-818-2924

EUROPE

Austria

Durisolstrasse 2A-4600 WelsAustria

Tel: 43-7242-2244-399Fax: 43-7242-2244-393

China - Shanghai

Room 701, Bldg. B

Far East International PlazaNo. 317 Xian Xia RoadShanghai, 200051Tel: 86-21-6275-5700 Fax: 86-21-6275-5060

Detroit

Tri-Atria Office Building

32255 Northwestern Highway, Suite 190Farmington Hills, MI 48334Tel: 248-538-2250Fax: 248-538-2260

Denmark

Regus Business CentreLautrup hoj 1-3

Ballerup DK-2750 Denmark

Tel: 45-4420-95 Fax: 45-4420-9910

China - Shenzhen

Rm. 1812, 18/F, Building A, United PlazaNo. 5022 Binhe Road, Futian DistrictShenzhen 518033, ChinaTel: 86-755-82901380 Fax: 86-755-8295-1393

Kokomo

2767 S. Albright Road Kokomo, IN 46902Tel: 765-8-8360Fax: 765-8-8387

France

Parc d’Activite du Moulin de Massy43 Rue du Saule TrapuBatiment A - ler Etage91300 Massy, FranceTel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79

China - Shunde

Room 401, Hongjian Building, No. 2

Fengxiangnan Road, Ronggui Town, ShundeDistrict, Foshan City, Guangdong 528303, ChinaTel: 86-757-28395507 Fax: 86-757-28395571

Los Angeles

25950 Acero St., Suite 200Mission Viejo, CA 92691Tel: 949-462-9523 Fax: 949-462-9608

China - Qingdao

Rm. B505A, Fullhope Plaza,No. 12 Central Rd.Qingdao 266071, China

Tel: 86-532-5027355 Fax: 86-532-5027205

Germany

Steinheilstrasse 10

D-85737 Ismaning, GermanyTel: 49--627-144-0 Fax: 49--627-144-44

San Jose

1300 Terra Bella AvenueMountain View, CA 94043Tel: 650-215-1444Fax: 650-961-0286

India

Divyasree Chambers1 Floor, Wing A (A3/A4)

No. 11, O’Shaugnessey RoadBangalore, 560 025, India

Tel: 91-80-22290061 Fax: 91-80-22290062

Italy

Via Salvatore Quasimodo, 1220025 Legnano (MI)Milan, Italy

Tel: 39-0331-742611 Fax: 39-0331-466781

Toronto

6285 Northam Drive, Suite 108

Mississauga, Ontario L4V 1X5, CanadaTel: 905-673-0699 Fax: 905-673-6509

Japan

Yusen Shin Yokohama Building 10F3-17-2, Shin Yokohama, Kohoku-ku,

Yokohama, Kanagawa, 222-0033, JapanTel: 81-45-471- 6166 Fax: 81-45-471-6122

Netherlands

Waegenburghtplein 4

NL-5152 JR, Drunen, NetherlandsTel: 31-416-690399 Fax: 31-416-690340

ASIA/PACIFIC

Australia

Microchip Technology Australia Pty LtdUnit 32 41 Rawson StreetEpping 2121, NSWSydney, AustraliaTel: 61-2-9868-6733 Fax: 61-2-9868-6755

Korea

168-1, Youngbo Bldg. 3 FloorSamsung-Dong, Kangnam-KuSeoul, Korea 135-882

Tel: 82-2-5-7200 Fax: 82-2-558-5932 or 82-2-558-5934

United Kingdom

505 Eskdale RoadWinnersh TriangleWokingham

Berkshire, England RG41 5TUTel: 44-118-921-5869Fax: 44-118-921-5820

07/12/04

DS21712B-page 20 2004 Microchip Technology Inc.

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