有机硅应用

9206 Thermally Conductive Potting is a 2-part high performance thermally conductive liquid material that cures into a elastomer. 9206 Thermally Conductive Potting is specifically designed with high shear thinning characteristics to support optimized mixing and dispensing. It is Designed to protect against moisture, environmental attack, mechanical and thermal shock as well as vibration where good thermally conductive is required. Typical applications include: encapsulation of amplifiers, automotive electronic units, ballast, bleed resistors, connectors, flyback transformers, high voltage resistor packs, lifting magnets, power controllers, power supplies, radio frequency induction transformers and sensing devices.

FEATURES

• High Thermal Conductivity: 0. W/m-°K

• Optimized flow characteristics for ease of dispensing.

• Flexible rubber - protects against mechanical shock and thermal cycling stress at components

• Addition cure system/ 100% solids: no cure by-products

• Stable and flexible from 50°C(58°F) to +200°C (392°F)

• RoHS Compliant to 2002/95/EU.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Appearance(Part A/Part B) Black/White

Viscosity at 23°C (Part A/Part B), mPa.s 2600/2400

Specific gravity at 23°C (Part A/Part B) 1.57/1.57

MIXING

9206 Thermally conductive potting is supplied in lot matched kits consisting of Part A and Part B in separate containers. During long periods of storage, some of the filler may settle at the bottom of the containers and should be individually homogenized prior to use. The two components should be thoroughly mixed using a weight or volume ratio of 1:1 until the mixture has a uniform colour.

POT LIFE

The catalysed viscosity of 9206 Thermally conductive potting after 2 minutes at 25°C is 2500mPa.s. This rises to about 5000mPa.s after 30 minutes at 25°C.

CURING

9206 Thermally conductive potting should be cured using one of the following recommended schedules:

24 hours at 23°C, or

5 hours at 70°C, or

1 hours at 125°C

Large components and assemblies may require longer times in order to reach the curing temperature.

TYPICAL CURING PERFORMANCE (Mixed 1:1 by weight)

Appearance Grey

Specific gravity at 23°C 1.57

Durometer, Shore A 58

Heat Capacity (J/g-°K) 1.05

TGA Weight Loss,24 hrs, 150°C % 0.22

Thermal conductivity, W/(m.K) 0.

ELECTRICAL

Dielectric Constant ,

100 Hz 3.38

100kHz 3.13

Dissipation Factor,

100 Hz 0.011

100kHz <0.001

Dielectric Strength, volts/mil (kV/mm) 470 (18.8)

Volume Resistivity, ohm-cm 3E+13

COMPATILITY

In some cases, 9206 Thermally conductive potting may fail to cure to optimum properties when in contact with certain plastics or rubbers. Cleaning the substrate with solvent or baking slightly above the cure temperature will normally eliminate the problem. Certain chemicals, curing agents and plasticisers can inhibit cure. These include:

- Organotin compounds

- Silicone rubber containing organotin catalysts

- Sulphur, polysulphides, polysulphones and other sulphur containing materials

- Amines, urethanes, amides and azides.

REPAIRABILITY

In the manufacture of electronic devices, it is often desirable to salvage or reclaim damaged or defective units. 9206 Thermally conductive potting offers excellent repairability to itself .It can be assisted by Gluefast Chemical Silicone Removal solvent. After the circuit board has been repaired, 9206 Thermally conductive potting can be reapplied.

USABLE LIFE AND STORAGE

Please stored at 25°C or below 25°C in the original unopened containers, this product has a usable life of 12 months from the date of production.

keep the container tightly sealed when not in use. A plug of used material may form in the tip of a tube or cartridge during storage. this is easily removed and does not affect the remaining contents

9206 导热灌封胶

9206 热导电盆栽是 2 部分高性能 thermally 导电液体材料可以治愈弹性体。9206 热导电灌封是专门设计来支持优化的混合和配药与高剪切细化特征。它旨在防止水分、 环境攻击、 机械和热休克以及振动情况良好导热是必需。典型的应用包括： 放大器、 汽车电子装置、 镇流器、 出血电阻、 连接器、 回扫变压器、 高压电阻包，提升磁体、 电源控制器、 电源、 射频感应变压器和传感装置的封装。 功能

• 高导热： 0. W/m-° K

• 优化流动特性为便于配药的。

• 灵活的橡胶-可防止机械震动和热循环应力在组件

• 加防治系统 / 100%固体： 没有治愈的副产品

· 稳定和更灵活的 50°C(58°F) + 200 ° c (392 ° F)

· 2002年/95/欧盟 RoHS。

供材料的典型特性

外观 (一部分一部分 A/B) 黑色/白色

在 23 ° C (部分 A/Part B) mPa.s 2600/2400年粘度

比重在 23 ° C (部分 A/Part B) 1.57/1.57 混合

9206 导热灌封组成部件 A 和 B 部分分开的容器中的很多匹配工具包中提供。在很长时间的存储，一定的填料可能定居在容器的底部，应使用单独同质化的前。这两个组件应彻底混合使用重量或体积比 1： 1，直到混合物具有均匀肤色。 锅生活

催化的粘度 9206 导热灌封 2 分钟后 25 ° c 的是 2500mPa.s。增加到约 5000mPa.s 后 30 分钟以 25 ° c。 固化

9206 导热灌封应可治愈使用以下建议的时间表：

24 小时 23 ° c，或

5 个小时在 70 ° C，或

1 小时在 125 ° C

大型部件和组件可能需要更长的时间，以达到固化温度。

典型固化性能 （混合 1： 1，按重量计）

外观灰色

在 23 ° C 1.57 比重

硬度计、 岸边一 58

热容量 (J/g-° K) 1.05

TGA 减肥，24 小时，150 ° C %0.22

热导率，W/(m.K) 0. 电气

介电常数，

100 3.38 Hz

100 千赫 3.13

耗散系数，

100 0.011 Hz

100 千赫 < 0.001

电介质强度、 伏/mil (kV/毫米) 470 (188)

体积电阻率、 欧姆厘米 3E + 13

COMPATILITY

在某些情况下，9206 导热灌封当接触某些塑料或橡胶治愈最佳属性可能失败。基板用溶剂清洗或略烘烤固化温度以上通常会消除这一问题。某些化学品、 固化剂、 增塑剂能抑制治愈。这些措施包括：

-有机锡化合物

-硅橡胶含锡催化剂

含硫，索利巴尔、 polysulphones 和其他含硫含材料

-胺、 粘合剂、 酰胺和叠氮化合物。 可修

在电子设备制造，它往往是宜抢救或回收损坏或有缺陷的单位。9206 导热灌封提供优秀可修到其自身。它可以协助 Gluefast 化学有机硅去除溶剂。电路板已经修好后，9206 导热灌封胶可以重新应用。

可用的生活和存储

请存储 25 ° c 或以下 25 ° C 原未开封的容器中，该产品具有生产之日起 12 个月的使用寿命。

将容器密封在不使用时。用材料的插头可能管或盒式磁带的提示中贮藏过程中形成。这容易拆卸，并不会影响剩余的内容