Conductive material for integrated circuit fabrica

专利名称：Conductive material for integrated circuit

fabrication

发明人：Yungjun Jeff Hu申请号：US09815949申请日：20010323

公开号：US20010042868A1公开日：20011122

摘要：A conductive composition of titanium boronitride (TiBN) is disclosed for use as aconductive material. The titanium boronitride is used as conductive material in the testingand fabrication of integrated circuits. For example, the titanium boronitride is used toconstruct contact pads such as inline pads, backend pads, sensors or probes. Advantagesof embodiments of the titanium boronitride include reduced scratching, increasedhardness, finer granularity, thermal stability, good adhesion, and low bulk resistivity.Exemplary methods of creating the titanium boronitride include a sputtering process anda plasma anneal process.

申请人：HU YUNGJUN JEFF

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