Multi-layer circuit board including reactance elem

专利名称：Multi-layer circuit board including reactance

element and a method of trimming areactance element in a circuit board

发明人：Hiroshi Sugawara,Tamotsu Kaneko,Sadahiro

Gomi,Masayuki Ito

申请号：US09218023申请日：19981222公开号：US06310527B1公开日：20011030

专利附图：

摘要：A reactance of a reactance element in a multi-layer circuit board apparatus is

trimmed by cutting a portion of the circuit pattern of the reactance element with a laserbeam. The reactance element is sandwiched between grounded layers. A coil circuitpattern having at least a hole therein may be provided as the reactance element. A sideportion between the edge of the coil circuit pattern and the hole is cut with the laserbeam to trim the inductive reactance. Cutting is effected while the circuit is operated andthe operating condition such as an oscillation frequency is observed. A plurality of holesmay be provided in the coil circuit pattern. The trimming amount of the inductivereactance is determined by the number of the hole subjected to cutting. The holes mayhave different sizes. The trimming amount is obtained by which one of the hole issubjected to cutting. The distance between the cut circuit pattern is equal to or largerthan the thickness of the circuit pattern. A capacitive element may be provided as thereactance element which includes first and second comb circuit patterns of which teethare interlace with each other. A portion of a tooth is cut to trim the capacitive reactance.Another capacitive reactance element including two conductor insulated with a dielectricsubstrate can be also trimmed similarly.

申请人：MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

代理机构：Connolly Bove Lodge & Hutz

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