专利名称：Method of and apparatus for making heat-sensitive stencil and heat-sensitive stencilmaterial
发明人：Jun Nakamura,Kenji Ohshima申请号：US101005申请日：20030815
公开号：US200400172A1公开日：20040513
专利附图：
摘要：When thermally perforating a thermoplastic resin film of heat-sensitive stencilmaterial by the use of a thermal head, supply of energy to the thermal head is cut at a
time the diameter of the perforations becomes not smaller than 65% and not larger than95% of a target diameter of the perforations.
申请人：RISO KAGAKU CORPORATION
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