SYSTEMS AND METHODS FOR WAFER ALIGNMENT

专利名称：SYSTEMS AND METHODS FOR WAFER

ALIGNMENT

发明人：Yang Chao,Keith E. Ypma,Steve J. Strauch申请号：US15657298申请日：20170724

公开号：US20170352563A1公开日：20171207

专利附图：

摘要：Various embodiments of aligning wafers are described herein. In oneembodiment, a photolithography system aligns a wafer by averaging individual vialocations. In particular, some embodiments of the present technology determine the

center locations of individual vias on a wafer and average them together to obtain anaverage center location of the set of vias. Based on a comparison of the average centerlocation to a desired center location, the present technology adjusts the wafer position.Additionally, in some embodiments, the present technology compares wafer via patternsto a template and adjusts the position of the wafer based on the comparison.

申请人：Micron Technology, Inc.

地址：Boise ID US

国籍：US

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