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SYSTEMS AND METHODS FOR WAFER ALIGNMENT

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专利名称:SYSTEMS AND METHODS FOR WAFER

ALIGNMENT

发明人:Yang Chao,Keith E. Ypma,Steve J. Strauch申请号:US15657298申请日:20170724

公开号:US20170352563A1公开日:20171207

专利附图:

摘要:Various embodiments of aligning wafers are described herein. In oneembodiment, a photolithography system aligns a wafer by averaging individual vialocations. In particular, some embodiments of the present technology determine the

center locations of individual vias on a wafer and average them together to obtain anaverage center location of the set of vias. Based on a comparison of the average centerlocation to a desired center location, the present technology adjusts the wafer position.Additionally, in some embodiments, the present technology compares wafer via patternsto a template and adjusts the position of the wafer based on the comparison.

申请人:Micron Technology, Inc.

地址:Boise ID US

国籍:US

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