CIRCUIT SUPPORT FOR AN ELECTRONIC CIRCUIT, AND MET

专利名称：CIRCUIT SUPPORT FOR AN ELECTRONIC

CIRCUIT, AND METHOD FOR

MANUFACTURING A CIRCUIT SUPPORT OFSAID TYPE

发明人：Michael Schöwel,Peter Helbig,Jozsef

Szekely,Sven Seifritz

申请号：US15736802申请日：20160518

公开号：US20180192507A1公开日：20180705

专利附图：

摘要：A circuit support for an electronic circuit may include at least one conductortrack, a first insulation material with which the at least one conductor track is

encapsulated by injection molding so as to form an insulating matrix and so as to leaveopen at least one first region for the connection of at least one electronic component ofthe electronic circuit, and a heat sink. The conductor track is encapsulated by injectionmolding with the first insulation material in such a way that the insulating matrixfurthermore leaves open at least one second region which is arranged between theconductor track and the heat sink. The circuit support may further include a largenumber of spacers which are designed and arranged in order to set a height of thesecond region. The circuit support may further include a second insulation material withwhich the second region is filled.

申请人：OSRAM GmbH

地址：Munich DE

国籍：DE

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