INJECTION MOLDING METHOD AND INJECTION MOLDING DEV

专利名称：INJECTION MOLDING METHOD AND

INJECTION MOLDING DEVICE FORTRANSPARENT RESIN MOLDED ARTICLE

发明人：Masahiro BESSHO,Naomoto

ISHIKAWA,Tsunetoshi TANEMURA

申请号：US14392280申请日：20140820

公开号：US20160263797A1公开日：20160915

专利附图：

摘要：The present invention effects a reduction in production cost and increases yield

of a transparent resin molded article and prevents the generation of defects such asbubbles, weld lines, and sink marks. This injection molding device (A) for a transparentresin molded article is equipped with: a die () for injection molding the transparent resinmolded article; and a gate () that is provided to the peripheral edge of the die () and thatis the inlet through which a resin material (R) is injected into the die (). The thicknessdimensions (Ta) of the die () are in the range of 15-25 mm, and the ratio of the diameterdimensions (D) of the gate () to the thickness dimensions (Ta) of the die () is set in therange of 1:6 to 1:3.

申请人：MITSUBISHI HEAVY INDUSTRIES, LTD.

地址：Tokyo JP

国籍：JP

更多信息请下载全文后查看